3 ECTS credits
80 u studietijd
Aanbieding 1 met studiegidsnummer 4017034ENR voor alle studenten in het 1e semester met een verdiepend master niveau.
Provide most recent developments in device and packaging technology. Main focus is on 2.5 and 3D circuit integration. Study the impact of these new technology features on the design flow, including circuit synthesis, place, route, thermal and mechanical analysis and co-optimization. Theoretical and practical aspects of the lectures will be illustrated using real world design examples.
Available on:
http://beams.ulb.ac.be/courses/ma2/advanced-manufacturing-technologies-packaging
Understand most recent developments in IC device and packaging technologies
Learn the impact of such technologies on system design and design flow
Analyse practical aspects of 2.5 and 3D design flows
Learn about EDA tools for optimised integration
Understand impact of holistic design space exploration
Learn about mechanical and thermal aspect of the IC design
Understand current and future challenges involved (e.g. automated system partitioning etc.)
De beoordeling bestaat uit volgende opdrachtcategorieën:
Examen Andere bepaalt 100% van het eindcijfer
Binnen de categorie Examen Andere dient men volgende opdrachten af te werken:
Practical work accounts for 50% of the final mark.The exam is oral, no handbook allowed, two questions 20min of preparation, 5-10min of presentation and Q&A session.
Deze aanbieding maakt deel uit van de volgende studieplannen:
Master in de ingenieurswetenschappen: elektronica en informatietechnologie: Standaard traject